ECE4754: Electronics Packaging Assembly, Reliability, Thermal Management, and Test

3 Credits

The course provides hands-on instruction in electronics packaging, including assembly, reliability, thermal management, and test of next-generation microsystems. Crosslisted with ME and MSE 4754.

Requisites

All Instructors

GPA: 3.51Most Common: A (53.7%)

This total includes data from semesters with unknown instructors

41 students
WFDCBA

  • Vince Kim

    Website Lead

Buzz Grades is maintained by Donghyun "Vince" Kim · Data: LITE (2016-2025), Course Catalog & OSCAR

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