ECE4755: Electronic Packaging Substrate Fabrication

3 Credits

This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.

Requisites

All Instructors

GPA: 3.61Most Common: A (66.7%)

This total includes data from semesters with unknown instructors

57 students
FDCBA


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