ECE6776: Integrated Low-Cost Microelectronics Systems Packaging
3 Credits
Introduction to cross-disciplinary microelectronic packaging technologies, including electrical design, thermal considerations and technologies, reliability, optoelectronic packaging, and RF-/mm-packaging. Crosslisted with ME and MSE 6776.
Requisites
Restrictions:
Cannot be enrolled in one of the following Levels: Undergraduate Semester (US)
Must be enrolled in one of the following Campuses: Georgia Tech-Atlanta * (A)
All Instructors
GPA: 3.64Most Common: A (61.8%)
This total includes data from semesters with unknown instructors