ME6776: Integrated Low-cost Microelectronics Systems Packaging
3 Credits
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-on-chip and system-on-package. Crosslisted with ECE and MSE 6776.
Requisites
Restrictions:
Cannot be enrolled in one of the following Levels: Undergraduate Semester (US)
Must be enrolled in one of the following Campuses: Georgia Tech-Atlanta * (A)
All Instructors
GPA: 3.58Most Common: A (55.3%)
This total includes data from semesters with unknown instructors