MSE6776: Integrated Low-cost Microelectronics Systems Packaging
3 Credits
Broad overview of system-level, cross-disciplinary microelectronics packaging technologies, including design, test, thermal, reliability, optoelectronics, and RF integration. Comparison of system-to-chip and system-to-package. Crosslisted with ECE and ME 6776.
Requisites
Restrictions:
Cannot be enrolled in one of the following Levels: Undergraduate Semester (US)
Must be enrolled in one of the following Campuses: Georgia Tech-Atlanta * (A)
All Instructors
GPA: 3.63Most Common: A (61.1%)
This total includes data from semesters with unknown instructors